Chromasens, a brand of TKH Vision, has released the 3DPIXA pro dual 200 µm camera, which combines line-scan imaging technology with high-speed 3D volumetric computing. With a 55-inch (1400 mm) field of view, it addresses some of the inspection and measurement challenges that arise when scanning large, complex or irregularly shaped objects to detect defects.
With a data rate of 29.7 kHz and an optical resolution of 200 µm, the 3DPIXA pro dual 200 µm camera simultaneously captures 2D color images and height maps or 3D point clouds, providing unparalleled quality inspection capabilities for a wide range of applications, including food processing, automotive manufacturing and natural products such as wood chips and ceramic tiles. The camera displays different colors on the depth map based on elevation differences, allowing the detection of overlapping or misaligned parts. The advanced triple-linear CCD RGB sensor with 10 µm x 10 µm pixels combined with an adaptive Camera Link interface improves imaging performance.
The 3DPIXA pro Dual 200 µm significantly reduces total operational costs by improving the efficiency of product certification. For example, in the automotive manufacturing industry, the camera optimizes the inspection of large body panels for cosmetic defects such as dents, scratches and wrinkles, as well as the detection of functional defects such as uneven bearing surfaces in swing arms or proper spacing and size of mounting holes in disc brake pads. This reduces scrap and manual inspection costs, resulting in a faster return on investment.
The 3DPIXA pro Dual 200 µm supports Chromasens’ own 3D-API as well as libraries for HALCON (MVTec), MIL (Matrox), LabVIEW (National Instruments) and Coake (SAC) to significantly simplify 3D system configuration. Designed for excellent performance in harsh industrial environments, the IP50 rated camera has a rugged housing measuring just 220.3 x 463 x 98.5 mm for use in space-constrained environments.
The Chromasens 3DPIXA pro dual 200 µm reflects the company’s commitment to imaging innovation, setting higher standards for 3D inspection and driving advancements in machine vision.
